Chemistry Industrial Chemistry PMDC Conceptual Practice
PMDC Verified Question 3 of 41
Which class of adhesives exhibits superior thermal resistance, shear modulus, and solvent resistance after complete curing?
A
Pressure-sensitive adhesives
B
Hot-melt adhesives
C
Solvent-borne adhesives
D
Thermosetting adhesives
Tap any option to test your recall and reveal the step-by-step Propolis autopsy.

Propolis Cognitive Error Autopsy

Official Correct Choice:
Option D: Thermosetting adhesives
Concept:

Thermosetting adhesives undergo irreversible cross-linking during curing to form dense, three-dimensional covalent networks that resist thermal degradation and solvent swelling.

Formula / Reaction:

Qualitative concept / No formula required.

Solution:

  • Thermosets (such as epoxy, phenolic, and polyurethane resins) develop covalent bridges between polymer chains.


  • This network structure prevents chain slippage at elevated temperatures, providing superior creep resistance and structural integrity.


Why other options are incorrect:

  • Pressure-sensitive adhesives: Viscoelastic materials held by weak physical bonds that soften and creep easily under heat and stress.


  • Hot-melt adhesives: Thermoplastic formulations that melt reversibly at elevated temperatures.


  • Solvent-borne adhesives: Un-crosslinked polymers that remain susceptible to solvent redissolution and thermal softening.

Quality & Fidelity Assurance: Every question on BeambePrep is rigorously curated against the official PMDC syllabus with zero filler, zero out-of-syllabus content, and zero typos. When an authentic past paper originally contained a historical mistake or ambiguity from the examining board (such as UHS or NUMS), BeambePrep faithfully reflects the original paper while detailing the nuance and scientific consensus in the autopsy above.

Want to solve full-length papers under timed exam conditions?

Practice with zero-scroll lockdown sprints, dynamic latency zone timers, live peer selection telemetry, and the automated Amber mistake recovery loop.